SSD 1TB INTEL M.2 660P SERIES, SSDPEKNW010T8X1
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INTEL® SSD 660P SERIES
Intel 660p SSD
Finally, PCIe and Intel QLC 3D NAND in one SSD.
The first QLC-based client PCIe SSD in the industry, the 660p SSD continuing Intel’s leadership in flash cell technology and quality manufacturing. The QLC technology enables higher storage density and lower cost per GB. The PCIe 3.0 x4 host interface delivers bus bandwidth up to 32Gbps that eliminates the bottleneck of SATA interface, taking you everyday computing experience to a new level. Meet today’s storage needs and prepare for the growing demands of tomorrow with the Intel SSD 660p Series.
Available in 512 GB, 1024 GB and 2048 GB to suit your needs.
Features and Benefits
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PCIe* Performance at an Affordable PriceEmpowered by Intel’s innovative Intel® QLC Technology, the Intel® SSD 660p offers higher capacities at a lower cost than TLC-based options.1 With PCIe*, the new SSD 660p skips SATA and its limitations to offer up to 2TB in one drive. |
Twice the Capacity in Identical Footprints2These client SSDs pack more data than TLC-based storage, allowing up to 2x more capacity in identical footprints. The thin M.2 80mm form factor makes it perfect for notebooks, desktops, and mobile devices that need storage for everyday computing. |
Performance and Price That MattersThe SSD 660p hits the marks that matter for client SSDs. This drive is tuned to deliver a capacity optimized NVMe* performance and deliver an intelligent storage option for mainstream and entry-level computing. |
Features At-a-Glance
| Model Name | Intel® Solid State Drive 660p Series |
| Capacity (GB) | 512, 1024 (1TB), 2048 (2TB) |
| NAND Flash Memory | 64-layer, QLC, Intel® 3D NAND Technology |
| Performance3 | Sequential Read: Up to 1,800MB/s, Sequential Write: Up to 1800MB/s Random 4KB Reads: Up to 250,000 IOPS, Random 4KB Writes: Up to 250,000 IOPS |
| Interface | PCIe* 3.0×4, NVMe* |
| Form Factor, Height, Weight | 80mm M.2 2280, S3, <10 grams |
| Power Consumption | Active: 100mW, Idle: 40mW |
| Operating Temperature | 0° C to 70° C |
Specification
Essentials
| Capacity | 1.024 TB |
| Launch Date | Q3’18 |
| Use Conditions | PC/Client/Tablet |
| Status | Launched |
| Lithography Type |
3D2 QLC
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Performance
| Sequential Read (up to) | 1800 MB/s |
| Random Read (8GB Span) (up to) | 150000 IOPS |
| Power – Active | 0.1 W |
| Sequential Write (up to) | 1800 MB/s |
| Random Write (8GB Span) (up to) | 220000 IOPS |
| Power – Idle | 0.040W |
Reliability
| Vibration – Operating | 2.17 GRMS |
| Shock (Operating and Non-Operating) | 1000 G |
| Endurance Rating (Lifetime Writes) | 200 TBW |
| Uncorrectable Bit Error Rate (UBER) | <1 sector per 10^15 bits read |
| Vibration – Non-Operating | 3.13 GRMS |
| Operating Temperature Range | 0°C to 70°C |
| Mean Time Between Failures (MTBF) | >= 1.6 million hours |
| Warranty Period | 1 Year Warranty |
Package Specifications
| Weight | <10 grams |
| Interface | PCIe NVMe 3.0 x4 |
| Form Factor | M.2 22 x 80mm |
Advanced Technologies
| Enhanced Power Loss Data Protection | No |
| High Endurance Technology (HET) | No |
| End-to-End Data Protection | Yes |
| Intel® Remote Secure Erase | No |
| Hardware Encryption | AES 256 bit |
| Temperature Monitoring and Logging | No |
| Intel® Smart Response Technology | Yes |
| Intel® Rapid Start Technology | Yes |
